IEEE 2008 International Interconnect Technology Conference 2-4 June 2008: Soliciting Papers
The IEEE—formerly known as the Institute of Electrical and Electronics Engineers—will hold its 11th International Interconnect Technology Conference in California on 2-4 June 2008. The 11th IITC Conference, the premier conference dedicated to advanced interconnect technology, is soliciting paper submissions for the 2008 conference.
The IITC provides a forum for professionals and researchers in semiconductor processing, advanced materials, equipment development and interconnect systems to present and discuss exciting new science and technology. Now in its second decade, the conference will include new subjects of interest.
Contributions from universities, national laboratories, and equipment and materials suppliers are encouraged. Contributed papers addressing all aspects of interconnect technology—materials and unit processes; process integration; process modeling; manufacturing issues; reliability; 3D processes and integration; interconnect systems; system in a package; system-on-a-chip; novel materials and concepts—will be rigorously reviewed and papers will be accepted for either oral or poster presentation.
Papers will be published in the conference digest and on CD-ROM. Complete details are available at: http://www.ieee.org/conference/iitc or by contacting the conference at iitc@his.com.
The IITC Conference is sponsored by the IEEE Electron Devices Society.
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CONTACT:
Wendy Walker, Conference Manager
Phone: 301-527-0900 x104
Fax: 301-527-0994
